Features – Ultra-small WLCSP for co-packaging in a SiP. No temperature sensor or heater. Designed for applications that can accept a wide temperature stability range. Interfaces to customer integrated circuit for oscillator functionality.
Applications – Bluetooth Smart.
Temperature Sensing MEMS Resonator
Features – Ultra-small WLCSP for co-packaging in a SiP. Integrated temperature sensor and heater for temperature compensation and calibration. Interfaces to customer integrated circuit for temperature compensation and oscillator functionality.
Applications – Cellular Transceivers, GPS/GNSS/WiFi Wireless Connectivity.
Temperature Compensated MEMS Oscillator
Features – MEMS resonator hermetically bonded to an RF ASIC containing oscillator and temperature compensation circuitry.
Applications – Communications Infrastructure, Industrial, and Military.