Sand 9 MEMS Resonators have high Q and low Rm, making them ideally suited for low power wireless applications such as Bluetooth Smart. The MR architecture consists of a piezoelectric MEMS resonator hermetically sealed in a wafer level chip scale package (WLCSP). The WLCSP die is 50% smaller than the smallest quartz device, and can be co-packaged with complimentary ICs to deliver an unprecedented level of integration to OEMs.
Sand 9 MR products feature fast start-up time as well as superior activity dip performance, resulting in an extremely reliable timing source. MR products are high-quality, rugged devices, enabling use in harsh environments.
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|Part #||Frequency||Operating Temperature||Dimensions||Integrated Heater||Integrated Temperature Sensor||Price|
|48 MHz||0C to +60C||.71x.79x.50mm||N/A||N/A||Contact Us|
|Part #||TM061||More Info|
|Operating Temperature||0C to +60C|
|Integrated Temperature Sensor||N/A|