MEMS Resonator

Sand 9 MEMS Resonators have high Q and low Rm, making them ideally suited for low power wireless applications such as Bluetooth Smart, Zigbee, and WLAN. The MR architecture consists of a piezoelectric MEMS resonator hermetically sealed in a wafer level chip scale package (WLCSP). The WLCSP die is 50% smaller than the smallest quartz device, and can be co-packaged with complimentary ICs to deliver an unprecedented level of integration to OEMs.

Sand 9 MR products feature fast start-up time as well as superior activity dip performance, resulting in an extremely reliable timing source. MR products are high-quality, rugged devices, enabling use in harsh environments.

To learn more about Sand 9 products please complete the request product information form.

Part # Frequency Operating Temperature Dimensions Integrated Heater Integrated Temperature Sensor Price
TM063
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48 MHz -40C to +85C .72x.80x.50mm N/A N/A Contact Us
TM062
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26 MHz -30C to +85C .72x.80x.50mm N/A N/A Contact Us
Part # TM063 More Info
Frequency 48 MHz
Operating Temperature -40C to +85C
Dimensions .72x.80x.50mm
Integrated Heater N/A
Integrated Temperature Sensor N/A
Price Contact Us
Contact Us
Part # TM062 More Info
Frequency 26 MHz
Operating Temperature -30C to +85C
Dimensions .72x.80x.50mm
Integrated Heater N/A
Integrated Temperature Sensor N/A
Price Contact Us
Contact Us

Contact Us

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