Sand 9 MEMS Resonators have high Q and low Rm, making them ideally suited for low power wireless applications such as Bluetooth Smart, Zigbee, and WLAN. The MR architecture consists of a piezoelectric MEMS resonator hermetically sealed in a wafer level chip scale package (WLCSP). The WLCSP die is 50% smaller than the smallest quartz device, and can be co-packaged with complimentary ICs to deliver an unprecedented level of integration to OEMs.
Sand 9 MR products feature fast start-up time as well as superior activity dip performance, resulting in an extremely reliable timing source. MR products are high-quality, rugged devices, enabling use in harsh environments.
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||Frequency ||Operating Temperature ||Dimensions ||Integrated Heater ||Integrated Temperature Sensor ||Price
|48 MHz ||-40C to +85C || .72x.80x.50mm ||N/A ||N/A ||Contact Us
|26 MHz ||-30C to +85C ||.72x.80x.50mm ||N/A ||N/A ||Contact Us