Careers

Responsibilities

• Write LabVIEW-based automated test programs in support of device characterization and in-house low volume production testing
• Perform design experiments and validation to facilitate design changes and tapeouts
• Perform data analysis on measurements taken and present results to a technical audience
• Develop documentation for test development work completed
• Develop schedules and status reports to track test development progress
• Requisition materials and equipment as needed
• Perform detailed FA on non-compliant devices
• Take initiative and work independently and without direct daily supervision to complete assigned tasks to defined work schedules
• May perform design schematic entry and layout for custom PCB test boards, as needed

Requirements

• BS or MSEE (Ph.D. is preferred) in mechanical or electrical engineering, or related areas
• 3-5 years’ experience with analog, RF, and DC measurement techniques
  • multi-port network analysis measurements, S-parameters, and impedance matrices
  • frequency and time-domain measurements
  • frequency stability measurements, long- and short-term, phase noise
  • differential resistance measurements, balanced bridges
• 3-5 years’ experience with wafer level probing equipment, probes (RF and DC), and calibration
• Experience handling wafers, manipulating miniature parts, and operating precision test equipment
• Extensive experience with test automation tools, connectivity, programming
  • NI LabVIEW proficiency required (including VISA, MAX); LabWindows/CVI and TestStand experience a plus
  • GPIB, SPI protocols and basic syntax knowledge
  • Demonstrated experience programming in either Python or VB. Familiarity with Matlab, C, and other scripting languages is a plus
  • Program debugging and exception handling for stability
• Experience with MEMS technology and MEMS device operation
• Hands-on experience with lab instrument automation, capabilities, and limitations (power supplies, signal source analyzers, DMMs, oscilloscopes, frequency counters, etc.)
• Experience with PCB and basic electronics bench work
• Excellent knowledge of general lab equipment and basic measurement techniques
• Good organization and communications skills
• Enjoy problem solving and finding creative solutions to challenging situations
• Positive work attitude with a desire to work in a dynamic and fast-paced environment
• Candidates must be hands-on and willing to roll up their sleeves to pitch in on whatever needs to be done at a small, growing company
• Eligible to work in the US

The candidate must have a proven track record of defining, developing, and optimizing MEMS process flows, as well as sophisticated problem solving experiences. The successful candidate is expected to innovate in the area of MEMS manufacturing, contribute to guiding the technical direction of the company by ensuring the MEMS product is manufactured consistently to Sand 9 quality and performance specifications, and drive programs to minimize costs.

Requirements

• Bachelor's or Master’s degree (Ph.D. preferred) in MEMS, material science, chemical engineering, electrical engineering, mechanical engineering, physics, or a related discipline
• Project management and leadership expertise, especially the ability to successfully interface with an international, remote foundry
• Ability to travel 35-45%, domestically and internationally
• 5 years' industrial experience in MEMS microfabrication and process development
• 2 years' experience leading a team of production development engineers
• Exposure to a wide breadth of MEMS fabrication technologies. Preferred emphasis includes plasma etch recipe development, wafer-level packaging, and optimization of thin film deposition
• Strong background in process development and integration, as well as the ability to propose modifications to improve and optimize existing fabrication processes
• Solid background in chemistry and materials science related to microfabrication
• Process modeling competency (SEMulator, SUPREM or similar)
• MEMS metrology expertise and surface analysis tools (SEM, EDX, AFM, XPS, SIMS, etc.)
• Advanced understanding of statistical analysis, process control, and design of experiments
• Experience with MEMS layout tools (L-Edit, AutoCAD, Cadence)
• Proficiency with data analysis software (JMP, Spotfire, R, Matlab, Mathematica)
• Strong organizational and communication skills
• Ability to multi-task and meet deadlines
• Positive work attitude with proven ability to achieve results in a fast moving, dynamic environment
• Strong problem solver with demonstrated ability to lead a team, with either internal or external resources, to generate solutions in a time-critical environment
• Bilingual in another language is desired (e.g., Japanese or Mandarin)
• Eligible to work in the US

Requirements

• Master’s degree in electrical engineering, mechanical engineering, materials science, and/or a MEMS/semiconductor-related field; or Bachelor’s degree with 2-3 years of relevant industrial experience
• Hands-on cleanroom experience, such as lithography and pattern transfer, deposition and etching, and metrology
• Exposure to MEMS technology and process challenges
• Solid experience with vector design software (Adobe Illustrator) and analysis software (e.g., Matlab, JMP, R, Spotfire)
• Basic programming skills, such as Python, C
• HTML experience is preferred
• Support transfer from development to production for processes variants
• Support process transfer to worldwide fabrication facilities, if needed
• Strong oral and written communications skills
• Positive work attitude with a desire to work in a dynamic and fast-paced environment
• Eligible to work in the US
   

The objective of the summer intern project is to study environmental effects on the resonator performance, including package-related effects. The successful candidate needs to be proficient with finite element modeling (FEM) and be able to determine effective model correlation test parameters. The candidate will work with a group of talented MEMS engineers and mixed-analog IC designers in an exciting startup environment. Please note that applications and interest in this program must be submitted through the ASEE website at http://nsfeifp.asee.org/.

Requirements

• Master’s or Ph.D. degree in engineering or physical sciences with at least two years of completion
• Finite Element Modeling experience (anisotropic and composite material experience is a plus)
• Experience with MEMS technology and processing
• Experience with MATLAB and LabView
• Knowledge of lab equipment and measurement techniques
• Self-starter with positive work attitude and a desire to work in a dynamic environment

Interested candidates may find more details about the program and apply online on the ASEE website: http://nsfeifp.asee.org/.

Requirements 

• MSEE degree with 5+ years' experience in analog or mixed-signal IC development, or PhD degree with 3+ years of experience in analog or mixed-signal IC development with a proven track record of putting designs into production
• Hands-on design experience with CMOS and/or bipolar mixed-signal custom circuit designs
• Experience with crystal oscillators, LC oscillators
• Must possess strong intuitive and analytical understanding of transistor-level design and simulation
• Must understand placement and layout issues with respect to mixed-signal IC design
• Experience with analog behavioral modeling in Cadence and/or MATLAB (preferred but not required)
• Cadence tool experience
• PLLs and ADC/DAC experience is preferred
• Strong written and verbal communication skills are required
• A thorough knowledge of lab equipment and measurement techniques
• Positive work attitude with a desire to work in a dynamic environment
• Eligible to work in the US
• Experience working in the early stages of a start-up or high-growth company is greatly desired. Candidates must be hands-on and willing to roll up their sleeves to pitch in on whatever needs to be done at a small company